The US has uncovered a major smuggling operation that moved over $160 million in restricted Nvidia AI chips to China. The scheme used falsified documents to bypass export controls, with funds traced back to China.
In a surprise post on Truth Social, President Trump announced he will allow Nvidia to ship its advanced H200 AI chips to China. The policy, which will also apply to AMD and Intel, immediately boosted the chipmakers’ stock prices in premarket trading.
AMD has made a major hire from Amazon Web Services to lead its charge into rack-scale AI infrastructure. Arvind Balakumar will head engineering for the ‘Helios’ platform, set to debut next year as AMD’s answer to Nvidia’s powerful AI server solutions.
Nvidia has locked in dates for its next GPU Technology Conference. GTC 2026 will run from March 15th to 18th in San Jose, with CEO Jensen Huang’s keynote on the 16th. The focus will be squarely on the Vera Rubin AI architecture and the future Feynman GPU.
According to Techmeme, Netflix privately pursued a Warner Bros. deal while its co-CEO publicly dismissed big media mergers. Meanwhile, India’s Tata Electronics has signed Intel as the first client for its upcoming $14 billion chip facilities in Gujarat and Assam.
Patent activity in gallium nitride (GaN) technology is booming, driven heavily by Chinese innovation. A key highlight from Q3 2025 is a US collaboration developing “phonon bridge” layers to solve critical heat issues in high-power devices.
Intel has officially added support for its BMG-G31 “Big Battlemage” GPU to its software stack. This move signals that a high-end Arc B770 graphics card, a major step up for Intel’s discrete GPU efforts, is nearing launch.
Apple’s top chip executive is reportedly considering leaving the company. This comes as Apple faces a series of high-profile departures and continues to play catch-up in artificial intelligence.
Analyst Jeff Pu expects Intel to secure a deal to fabricate Apple-designed chips for future non-pro iPhones starting in 2028. This would be part of a broader move to diversify Apple’s chipmaking away from TSMC.
onsemi has launched its EliteSiC MOSFETs in an industry-standard T2PAK top-cool package. The move targets the critical thermal management issues in high-power applications like electric vehicles and solar inverters. Initial devices are shipping now, with more planned for late 2025.
